HP leadership panel

12 September 2023, 11:00 - 12:00 Hall 11, Meeting room 1124
**Free to attend for all Labelexpo Europe 2023 visitors**
HP’s leadership panel is hosted by Dscoop's Peter van Teeseling, and features an unprecedented gathering of label industry giants  - CCL Industries, MCC Label, and All4Labels - Global Packaging Group.
This is a unique opportunity for you to gain valuable insights from global experts on issues like labour shortage, automation, and sustainability. 
  • Dimitri Stamatiou, VP Innovations and Engineering, MCC
  • Lee Prestell, VP Healthcare and Specialty, CCL
  • Jens Nilsson, Chief Technology Officer, All4Labels
Hosted by:
  • Peter van Teeseling, Executive Director, dscoop

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