Pasar al contenido principal

16 – 19 Septiembre 2025, | Fira Gran Via, Barcelona, Spain

Etiquetas Empaques flexibles Cajas plegables

TE Connectivity presents portfolio

TE Connectivity’s portfolio is engineered to meet the traceability and compliance needs in modern electronics manufacturing.

Te
Publicado 07/21/2025 - 14:45

TE high quality PCB Labels for precision traceability in Electronics Manufacturing

TE Connectivity’s new generation PCB Labels portfolio is engineered to meet the traceability and compliance needs in modern electronics manufacturing. The portfolio is pre-tested and qualified for the most demanding of the industries—whether building automotive ECUs, aerospace systems, or high-density PCBs, the labels are designed to withstand harsh environments while seamlessly integrating into the production flow.

 

TE high performance custom Front Panel labels for OEM Interface

TE Connectivity’s new line of Front Panel Labels is designed to bring durability, design clarity, and superior functionality to the most critical interface of a device—the front panel. Whether used in medical devices, industrial controls, or telecom enclosures, these labeling solutions are carefully engineered to deliver exceptional performance and long-term reliability.


Related news articles

Comienza tu viaje aquí

3 sencillos pasos para registrarte y asistir

  1. Revisa los precios de los boletos y las fechas límite
  2. Reserva tus boletos
  3. Asiste al evento

// INSIGHTS DE LABELEXPO EUROPE

Mantente al día con las últimas actualizaciones por correo electrónico y de forma gratuita.

No te pierdas ninguna novedad de la industria de impresión de etiquetas y empaques. ¡Suscríbete gratis hoy!

 

Síguenos en X <i class="fa-brands fa-x-twitter"></i>
Dale "me gusta" y comparte nuestras actualizaciones <i class="fa-brands fa-facebook-f"></i>