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Guangzhou Tongfei Technologies showcase InSenXe Infrared Measurement Systems

Guangzhou Tongfei Technologies / InSenXe: Pioneering Precision in Label Converting with Advanced Infrared Measurement

Tongfei
Publié 08/08/2025 - 15:30

At Labelexpo Europe 2025, Guangzhou Tongfei Technologies / InSenXe Infrared Measurement Systems will showcase its cutting-edge solutions designed to revolutionize quality control and process efficiency for label and packaging converters. As global leaders in non-contact infrared measurement, our core expertise lies in delivering unmatched precision for critical converting parameters.


Visitors to our stand 3G07  will discover our flagship InSenXe Infrared Measurement Systems. These systems provide real-time, in-line monitoring of:
Adhesive Coating Weight: Ensuring consistent application and optimal bond strength while minimizing waste.


UV/EB/Water-based Coating Thickness: Guaranteeing perfect coverage, curing performance, and functional properties.
Moisture Content: Critical for process stability and preventing defects in various substrates.


Our technology empowers converters with data-driven insights, enabling immediate process adjustments, significant material savings, reduced energy consumption, and guaranteed product quality. Designed for the high-speed demands of modern presses, InSenXe systems are the intelligent foundation for Industry 4.0-ready converting lines, facilitating predictive maintenance and seamless integration.


"We're incredibly excited to connect with the European label and packaging community in Barcelona," says [Name], [Title] at Guangzhou Tongfei/InSenXe. "Our goal is to demonstrate how precise infrared measurement directly tackles converters' biggest challenges: reducing costs, eliminating waste, and ensuring flawless quality. We look forward to discussing your specific production hurdles and showcasing how our technology can optimize your operations."


Discover the future of precision converting with Guangzhou Tongfei / InSenXe at Labelexpo Europe 2025.
 


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